EP2C20

Part No.:
EP2C20
Download:
Download
Description:
Cyclone Series Device Thermal Resistance
File Size:
158 K
Page:
7 Pages
Logo:
Maker:
ALTERA [ ALTERA CORPORATION ]
PCB Prototype

July 16, 2018:

EPF8074G

ERJ-3EKF2322V

ERJ-3EKF2371V

ERJ-8GEYJ100V

ESDALC6V1P

EVAL-418-B

EVAL-ADAU1442EBZ

EVQQ0C

FA10342_OSS-W

FAN5236_10

FAN7171

FAN8200DTF

PCB Datasheet:1PCB Datasheet:1PCB Datasheet:1
Cyclone Series Device
Thermal Resistance
May 2008, version 3.0
Data Sheet
Revision
History
Date
May 2008
July 2007
May 2007
March 2007
April 2006
The following table shows the revision history for this data sheet.
Document Version
3.0
2.2
2.1
2.0
1.0
Changes Made
Updated
Tables 2, 4,
and
5.
Updated values for EP3C25 (E144) device in Table 2.
Updated values for EP3C10 (E144) device in Table 2 and added
Revision History.
Added Cyclone III information.
Initial release.
Tables 1
through
6
in this data sheet provide
θ
JA
(junction-to-ambient
thermal resistance) and
θ
JC
(junction-to-case thermal resistance) values
for Altera
®
Cyclone
®
series devices available in Ball-Grid Array (BGA),
FineLine
®
BGA (FBGA), Micro FineLine BGA
®
(MBGA), Ultra FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
f
For additional packaging information, refer to the
Altera Device Packaging
Data Sheet.
Altera Corporation
DS-CYTHRML-3.0
1