TE28F160S3-100,TE28F160S3-120

Part No.:
TE28F160S3-100,TE28F160S3-120
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Description:
WORD-WIDE FlashFile MEMORY FAMILY
File Size:
1261 K
Page:
52 Pages
Logo:
Maker:
INTEL [ INTEL CORPORATION ]
PCB Prototype

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PCB Datasheet:1PCB Datasheet:1
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ADVANCE INFORMATION
WORD-WIDE
FlashFile™ MEMORY FAMILY
28F160S3, 28F320S3
Includes Extended Temperature Specifications
Two 32-Byte Write Buffers
2.7
µs
per Byte Effective
Programming Time
Low Voltage Operation
2.7V or 3.3V V
CC
2.7V, 3.3V or 5V V
PP
100 ns Read Access Time (16 Mbit)
110 ns Read Access Time (32 Mbit)
High-Density Symmetrically-Blocked
Architecture
32 64-Kbyte Erase Blocks (16 Mbit)
64 64-Kbyte Erase Blocks (32 Mbit)
System Performance Enhancements
STS Status Output
Industry-Standard Packaging
µBGA*
package, SSOP, and
TSOP (16 Mbit)
µBGA*
package and SSOP (32 Mbit)
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Cross-Compatible Command Support
Intel Standard Command Set
Common Flash Interface (CFI)
Scaleable Command Set (SCS)
100,000 Block Erase Cycles
Enhanced Data Protection Features
Absolute Protection with V
PP
= GND
Flexible Block Locking
Block Erase/Program Lockout
during Power Transitions
Configurable x8 or x16 I/O
Automation Suspend Options
Program Suspend to Read
Block Erase Suspend to Program
Block Erase Suspend to Read
ETOX™ V Nonvolatile Flash
Technology
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Intel’s Word-Wide FlashFile™ memory family provides high-density, low-cost, non-volatile, read/write storage
solutions for a wide range of applications. The Word-Wide FlashFile memories are available at various
densities in the same package type. Their symmetrically-blocked architecture, flexible voltage, and extended
cycling provide highly flexible components suitable for resident flash arrays, SIMMs, and memory cards.
Enhanced suspend capabilities provide an ideal solution for code or data storage applications. For secure
code storage applications, such as networking, where code is either directly executed out of flash or
downloaded to DRAM, the Word-Wide FlashFile memories offer three levels of protection: absolute protection
with V
PP
at GND, selective block locking, and program/erase lockout during power transitions. These
alternatives give designers ultimate control of their code security needs.
This family of products is manufactured on Intel’s 0.4
µm
ETOX™ V process technology. It comes in the
industry-standard 56-lead SSOP and
µBGA
packages. In addition, the 16-Mb device is available in the
industry-standard 56-lead TSOP package.
June 1997
Order Number: 290608-001