75117-1118

Part No.:
75117-1118
Download:
Download
Description:
2.00mm (.079) Pitch VHDM® Board-to-Board Stacker Receptacle, Vertical, 8-Row, 80 Circuits, 1.27μm (50μ) Gold (Au)
File Size:
496 K
Page:
4 Pages
Logo:
Maker:
MOLEX [ Molex Electronics Ltd. ]
PCB Prototype

July 19, 2018:

760930001

770584-1

801-91-016-10-003

813322BK-02T

84334C

85013-2012

85042-0074

87759-1264

87824-0010

87831-0621

87832-4620

87834-2019

PCB Datasheet:1
This document was generated on 05/17/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0751171118
Active
vhdm
2.00mm (.079") Pitch VHDM® Board-to-Board Stacker Receptacle, Vertical, 8-Row, 80
Circuits, 1.27µm (50µ") Gold (Au)
Documents:
Packaging Specification (PDF)
Drawing (PDF)
Product Specification PS-74031-999 (PDF)
RoHS Certificate of Compliance (PDF)
image - Reference only
Backplane Connectors
75117
Daughtercard
<a href="http://www.molex.com/pdm_docs/ats/
TM-622010999.pdf">Tooling Manual</a>
Stack Height 18mm (.708"), Lead Free
PCB Prototyping Receptacle
vhdm
VHDM®
N/A
EU RoHS
China RoHS
RoHS Compliant by
Exemption
REACH SVHC
Not Reviewed
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
Series
General
Product Family
Series
Application
Application Tooling Documents
Comments
Component Type
Overview
Product Name
Style
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
80
80
Black
200
No
No
None
Copper-Nickel-Silicon, High Performance Alloy (HPA)
Gold
Tin-Lead
High Temperature Thermoplastic
N/A
Open Pin Field
8
Vertical
None
0.070 In
1.80 mm
Tube
0.079 In
2.00 mm
50
1.25
30
0.75
No
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
75117Series
Mates With
74060 VHDM® Board-to-Board Backplane
Header
Application Tooling
|
FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
VHDM® Single
0622021450
Wafer Removal Tool,
8 Row
Electrical
Current - Maximum per Contact
Data Rate
1A
3.125 Gbps