74LVC1G240DBVRE4,74LVC1G240DBVRG4,74LVC1G240DBVTE4,74LVC1G240DBVTG4,74LVC1G240DCKRE4,74LV

Part No.:
74LVC1G240DBVRE4,74LVC1G240DBVRG4,74LVC1G240DBVTE4,74LVC1G240DBVTG4,74LVC1G240DCKRE4,74LV
Download:
Download
Description:
SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT
File Size:
494 K
Page:
14 Pages
Logo:
Maker:
TI [ TEXAS INSTRUMENTS ]
PCB Prototype

July 19, 2018:

75117-1118

760930001

770584-1

801-91-016-10-003

813322BK-02T

84334C

85013-2012

85042-0074

87759-1264

87824-0010

87831-0621

87832-4620

PCB Datasheet:1
SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
www.ti.com
SCES305J – JANUARY 2001 – REVISED JANUARY 2007
FEATURES
Available in the Texas Instruments
NanoFree™ Package
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 3.7 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
DBV PACKAGE
(TOP VIEW)
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
OE
A
GND
1
5
V
CC
OE
A
1
2
3
5
V
CC
GND
A
OE
3 4
2
1 5
Y
V
CC
2
GND
4
4
Y
3
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C SOT (SOT-23) – DBV
SOT (SC-70) – DCK
(1)
(2)
Reel of 3000
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
ORDERABLE PART NUMBER
SN74LVC1G240YZPR
SN74LVC1G240DBVR
SN74LVC1G240DBVT
SN74LVC1G240DCKR
SN74LVC1G240DCKT
TOP-SIDE MARKING
(2)
_ _ _CK_
C40_
CK_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB Prototyping design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated