TPA741,TPA741_07,TPA741D,TPA741DGN,TPA741DGNG4,TPA741DGNR,TPA741DGNRG4,TPA741DR,TPA741DRG

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TPA741,TPA741_07,TPA741D,TPA741DGN,TPA741DGNG4,TPA741DGNR,TPA741DGNRG4,TPA741DR,TPA741DRG
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Description:
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS
File Size:
696 K
Page:
24 Pages
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Maker:
TI [ TEXAS INSTRUMENTS ]
PCB Prototype

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PCB Datasheet:1PCB Datasheet:1PCB Datasheet:1
www.ti.com
TPA741
SLOS316C – JUNE 2000 – REVISED JUNE 2004
700-mW MONO LOW-VOLTAGE AUDIO POWER
AMPLIFIER WITH DIFFERENTIAL INPUTS
FEATURES
Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility 2.5 V - 5.5 V
Output Power for R
L
= 8
– 700 mW at V
DD
= 5 V
– 250 mW at V
DD
= 3.3 V
Integrated Depop Circuitry
Thermal and Short-Circuit Protection
Surface-Mount Packaging
– SOIC
– PowerPAD™ MSOP
D OR DGN PACKAGE
(TOP VIEW)
DESCRIPTION
The TPA741 is a bridge-tied load (BTL) audio power
amplifier developed especially for low-voltage appli-
cations where internal speakers are required.
Operating with a 3.3-V supply, the TPA741 can
deliver 250-mW of continuous power into a BTL 8-Ω
load at less than 0.6% THD+N throughout voice band
frequencies. Although this device is characterized out
to 20 kHz, its operation is optimized for narrower
band applications such as wireless communications.
The BTL configuration eliminates the need for exter-
nal coupling capacitors on the output in most appli-
cations, which is particularly important for small
battery-powered equipment. This device features a
shutdown mode for power-sensitive applications with
a supply current of 7 µA during shutdown. The
TPA741 is available in an 8-pin SOIC surface-mount
package and the surface-mount PowerPAD™ MSOP,
which reduces board space by 50% and height by
40%.
SHUTDOWN
BYPASS
IN+
IN–
1
2
3
4
8
7
6
5
V
O
GND
V
DD
V
O
+
V
DD
6
R
F
Audio
Input
R
I
C
I
4
3
IN–
IN+
V
DD
/2
V
O
+ 5
C
S
+
V
DD
2
C
B
BYPASS
+
V
O
– 8
7
GND
700 mW
From System Control
1
SHUTDOWN
Bias
Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2004, Texas Instruments Incorporated