3.3 V ABT OCTAL BUS TRANSCEIVER AND REGISTER
WITH 3 STATE OUTPUTS
SCBS776 − NOVEMBER 2003
− One Assembly/Test Site, One Fabrication
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
Supports Unregulated Battery Operation
Down To 2.7 V
(Output Ground Bounce)
<0.8 V at V
= 3.3 V, T
and Power-Up 3-State Support Hot
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Latch-Up Performance Exceeds 500 mA Per
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
This bus transceiver and register is designed specifically for low-voltage (3.3-V) V
operation, but with the
capability to provide a TTL interface to a 5-V system environment.
The SN74LVTH652 consists of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the data bus or from the internal storage registers.
Output-enable (OEAB and OEBA) inputs are provided to control the transceiver functions. Select-control (SAB
and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for
select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between
real-time and stored data. A low input selects real-time data and a high input selects stored data. Figure 1
illustrates the four fundamental bus-management functions that can be performed with the SN74LVTH652
−40°C to 85°C
TSSOP − PW
Tape and reel
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB Manufacturing
design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265