PCB Capabilities

No.	Item	Capability	Details
1	Layer	1-8 layer	1-8 layer PCB prototypes
2	Thickness	0.4--3.0mm	0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm
3	Thickness Tolerance( t≥1.0mm)	± 10%	+10% will occur for the technologies like electroless copper, solder mask and pad plating.
4	Thickness Tolerance( t<1.0mm)	±0.1mm	+0.1mm will occur for the technologies like electroless copper, solder mask and pad plating.
5	Ink	TAIYO	White: TAIYO 2000 series Green: TAIYO 07 series
6	Material	FR-4	FR-4 material only (KB6160A TG130)
7	Max. Dimension	550x650mm	Standard dimension is 550*650mm
8	Dimension Tolerance(Outline)	±0.15mm	±0.15mm for CNC routing, and ±0.5mm for V-scoring
9	Min. Trace	4mil（0.1mm）	Min. trace is 4 mil. More than 6 mil is recommended to save cost.
10	Min. Spacing	4mil（0.1mm）	Min. spacing is 4 mil. More than 6 mil is recommended to save cost.
11	Finished Outlayer Copper	35um/75um（1 OZ/2 OZ）	Also known as copper weight. 35μm=1oz, 70μm=2oz
12	Finished Inerlayer Copper	35um	35μm=1oz
13	Drill Size	0.25--6.3mm	Min. drill size is 0.25mm, Max. drill size is 6.3mm. Any holes greater than 6.3mm will charge extra fee.
14	Annular Ring	≥0.153mm（6mil）	Annular ring surrounded by traces should be equal to or larger than 0.153mm(6mil).
15	Finished Hole Size	0.25--6.5mm	For the plated hole wall, the finished hole size is smaller than the one in file.
16	Hole Size Tolerance	±0.075mm	eg. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable.
17	Solder Mask	LPI	Liquid Photo-Imageable Solder Mask
18	Min. Character Width	≥0.15mm	Characters width less than 0.15mm will be unidentifiable.
19	Min. Character Height	≥0.8mm	Characters height less than 0.8mm will be unidentifiable.
20	Character Width to Height Ratio	1:5	1:5 is the best ratio for producation.
21	Trace to Outline	≥0.3mm（12mil）	Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to Outline
22	Panelization without space	0	For V-scoring panelization, set the space between boards to be 0.
23	Panelization with space	1.6mm	For Rounting panelization,set the space between boards to be ≥1.6mm.
24	Polygon Pour with Pads	Hatch	Please attention that we will apply Hatch to do Polygon Pour if your PCBs designed with Pads.
25	Slot Drawing with Pads	Drill Drawing Layer	With many unplated grooves, please draw them in Drill Drawing Layer.
26	Protel/dxp Override Layer	Solder Layer	Do not mistake the Paste Layer as Solder Layer.
27	Protel/dxp Keepout Layer	Keepout Layer/Mechanical Layer	Choose one from Keepout Layer or Mechanical Layer as outline.
28	Min. Half Hole Diameter	0.6mm	Half hole is a special technology, so half hole diameter should be greater than 0.6mm.
29	Soldermask Bridge	0.1mm	Solderbridge is available but it will charge extra fee.