| No. | Item | Capability | Details |
|---|---|---|---|
| 1 | Layer | 1-8 layer | 1-8 layer PCB prototypes |
| 2 | Thickness | 0.4--3.0mm | 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm |
| 3 | Thickness Tolerance( t≥1.0mm) | ± 10% | +10% will occur for the technologies like electroless copper, solder mask and pad plating. |
| 4 | Thickness Tolerance( t<1.0mm) | ±0.1mm | +0.1mm will occur for the technologies like electroless copper, solder mask and pad plating. |
| 5 | Ink | TAIYO | White: TAIYO 2000 series Green: TAIYO 07 series |
| 6 | Material | FR-4 | FR-4 material only (KB6160A TG130) |
| 7 | Max. Dimension | 550x650mm | Standard dimension is 550*650mm |
| 8 | Dimension Tolerance(Outline) | ±0.15mm | ±0.15mm for CNC routing, and ±0.5mm for V-scoring |
| 9 | Min. Trace | 4mil（0.1mm） | Min. trace is 4 mil. More than 6 mil is recommended to save cost. |
| 10 | Min. Spacing | 4mil（0.1mm） | Min. spacing is 4 mil. More than 6 mil is recommended to save cost. |
| 11 | Finished Outlayer Copper | 35um/75um（1 OZ/2 OZ） | Also known as copper weight. 35μm=1oz, 70μm=2oz |
| 12 | Finished Inerlayer Copper | 35um | 35μm=1oz |
| 13 | Drill Size | 0.25--6.3mm | Min. drill size is 0.25mm, Max. drill size is 6.3mm. Any holes greater than 6.3mm will charge extra fee. |
| 14 | Annular Ring | ≥0.153mm（6mil） | Annular ring surrounded by traces should be equal to or larger than 0.153mm(6mil). |
| 15 | Finished Hole Size | 0.25--6.5mm | For the plated hole wall, the finished hole size is smaller than the one in file. |
| 16 | Hole Size Tolerance | ±0.075mm | eg. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable. |
| 17 | Solder Mask | LPI | Liquid Photo-Imageable Solder Mask |
| 18 | Min. Character Width | ≥0.15mm | Characters width less than 0.15mm will be unidentifiable. |
| 19 | Min. Character Height | ≥0.8mm | Characters height less than 0.8mm will be unidentifiable. |
| 20 | Character Width to Height Ratio | 1:5 | 1:5 is the best ratio for producation. |
| 21 | Trace to Outline | ≥0.3mm（12mil） | Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to Outline |
| 22 | Panelization without space | 0 | For V-scoring panelization, set the space between boards to be 0. |
| 23 | Panelization with space | 1.6mm | For Rounting panelization,set the space between boards to be ≥1.6mm. |
| 24 | Polygon Pour with Pads | Hatch | Please attention that we will apply Hatch to do Polygon Pour if your PCBs designed with Pads. |
| 25 | Slot Drawing with Pads | Drill Drawing Layer | With many unplated grooves, please draw them in Drill Drawing Layer. |
| 26 | Protel/dxp Override Layer | Solder Layer | Do not mistake the Paste Layer as Solder Layer. |
| 27 | Protel/dxp Keepout Layer | Keepout Layer/Mechanical Layer | Choose one from Keepout Layer or Mechanical Layer as outline. |
| 28 | Min. Half Hole Diameter | 0.6mm | Half hole is a special technology, so half hole diameter should be greater than 0.6mm. |
| 29 | Soldermask Bridge | 0.1mm | Solderbridge is available but it will charge extra fee. |
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